Fundamental Of Testing On ATE /半导体测试原理
SoftTest的测试原理行业内基本上无人不知，这份好像是泰瑞达出品的，讲得也非常好，基于ATE的测试原理，要更接近于实际测试应用。1. Introduction to Semiconductor Testing Design and manufacturing cycle of anIC Semiconductor Companies/Staffs ATE – Automated Test Equipment and itscomponents Load boards, Probe cards, Handlers, Probers 2.Project Plan, Specifications and Test Program Project/Test Plan – Introduction,Benefits, Requirement, Sample Specifications – Design, Test, Device,Sample Test Program – Types, Consideration, TestFlow, Binning, Summary Common Categories of Test for SemiconductorDevice Functional, DC, AC Specifications of Device3. DC Parameters Test (includingContinuity Test) Continuity Test - Concept, Test Method,Sample Datalog DC Tests – Concept and Test Method Power Supply Current Test (IDD) Leakage Test (IIL/IIH) IOZL/IOZH, IOS VOL/IOL, VOH/IOH ATE DC Subsystem - VI Source, DC Meter,DC Matrix, Relay Control4. DigitalFunctional Test ATE Pin Electronics Test Concepts – Pattern, Timing, Levels IO Signals – Input Signal Generation,Output Signal Compare Functional Testing Basic – ExampleVIL/VIH, VOL/VOH Test Vectors5. AC Parameters Test AC Timing Tests - Setup Time, Hold Time,Propagation Delay, etc ATE Time Measurement Subsystem Timing Calibration6. Introduction toMixed Signal Testing Sampling Theory – Nyquist Theorem,Coherency Formula Fast Fourier Transform (FFT) – FrequencyDomain Analysis Generic Mixed Signal Tester Architecture –AWG and Digitizer7. ADC and DAC Test ADC and DAC Basic Static Test – Histogram method (INL, DNL) Dynamic Test – SNR, THD, SINAD8. Debug Tools andDebugging Tools - Datalog, Histogram, Shmoo, PatternDebugger, Waveform Tool Trouble-Shooting Techniques 9. Introduction toDesign-For-Testability DFT consideration Test Approach – AdHoc, Scan (andBoundary Scan), Self-Test (BIST)
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