ict 发表于 2012-10-14 11:19:51

GPIB通信协议手册 [pdf]

GPIB是测试机和分选机的标准通信协议,而且我们可以在GPIB的接口上挂接其他设备来侦测GPIB信号,如果您需要做类似的设备,那么你就必须深入了解一下GPIB协议,那么这一本书你就非下载不可了。





1  PROBER SYSTEM SOFTWARE VERSION..................................................................... 1
2 INTERFACE SPECIFICATIONS...................................................................................... 2
2.1 Interface Configuration .................................................................................................. 2
2.2 Bus Lines......................................................................................................................... 2
2.3 Message ........................................................................................................................... 2
3  PROBER OPERATIONS AND COMMANDS................................................................... 3
3.1 Commands........................................................................................................................... 3
3.2 Status Reporting................................................................................................................. 7
3.3  Setup of Operating Environment..................................................................................... 11
3.3.1  Setup before Initialization ..........................................................................................11
3.3.2  Setup after Initialization ............................................................................................19
3.3.3  Status Byte (STB) code setting...................................................................................29
3.4  Examples of Prober Control with GP-IB Commands ..................................................... 30
4  DESCRIPTION ON COMMANDS................................................................................... 34
4.1  A (String) : XY travel (absolute distance).................................................................... 34
4.2  B : Request of prober ID ............................................................................................... 35
4.3  C : Marking.................................................................................................................... 35
4.4  CM: Contact Positioning............................................................................................... 35
4.5  D : Z DOWN................................................................................................................... 36
4.6  E : Error code request ................................................................................................... 36
4.7  F : FAIL counting-up .................................................................................................... 37
4.8  F (String) : F-axis fine adjustment............................................................................... 37
4.9  G : Positioning start die................................................................................................ 38
4.10  H : Multi-site location No. request............................................................................... 39
4.11  I : Index size setting...................................................................................................... 39
4.12  J : Positioning next die / target die .............................................................................. 40
4.13  K : Stop .......................................................................................................................... 43
4.14 L: Unload/load/align...................................................................................................... 44
4.15  L1 : Wafer loading without alignment ......................................................................... 46
4.16  L8 : Pre-loading............................................................................................................. 47
4.17  L9 : Load from inspection tray (without alignment) ................................................... 48
4.18  LI: Load from Inspection tray (with alignment) ......................................................... 48
4.19  M : Marking................................................................................................................... 49
4.20  ML : Microscope Illumination ...................................................................................... 52
4.21  N : Alignment retry....................................................................................................... 53
4.22  N1 : Alignment retry (alignment only) ........................................................................ 54
4.23  N2 : Retry of probe-pad alignment............................................................................... 55
4.24  N9 : Wafer/probe-pad alignment .................................................................................. 56
4.25  O : On-wafer information request ................................................................................ 57
4.26  P : PASS counting-up.................................................................................................... 58
4.27  Q : XY coordinates request ........................................................................................... 59
4.28  R : XY coordinates (absolute values) request .............................................................. 59
4.29  S (String) : XY travel (by relative coordinates) ........................................................... 60
4.30  T : Test start.................................................................................................................. 61
4.31  U : Unloading ................................................................................................................ 61
4.32  U0 : Unloading all wafers............................................................................................. 62
4.33  U9 : Unloading to inspection tray ................................................................................ 63
4.34  V : Lot number request ................................................................................................. 63
4.35  W : Needle cleaning....................................................................................................... 64
4.36  WB: Perform brush cleaning ........................................................................................ 64
4.37  WL: Completion of Downloading Test Result.............................................................. 65
4.38  WM: Download Summarized Test Result .................................................................... 65
4.39  X : Wafer number request............................................................................................. 67
4.40  Y : Gross value request ................................................................................................. 67
4.41  Z : Z UP.......................................................................................................................... 68
4.42  Z± : Chuck height fine adjustment............................................................................... 69
4.43  ZC: Z Clearance Position / Origin Position Move ........................................................ 70
4.44  a : Parameter setting .................................................................................................... 71
4.45  al: Assign-load setting .................................................................................................. 73
4.46  b : Wafer ID request...................................................................................................... 73
4.47  c: Pass/Fail counts request ........................................................................................... 74
4.48 clk: Lock/Unlock Loader cassette ................................................................................. 74
4.49  d  : Directory request .................................................................................................... 75
4.50  du: Up-load device data ................................................................................................ 77
4.51  dd: Down-loading device data....................................................................................... 83
4.52  e : Error message request ............................................................................................. 86
4.53  em: Alarm buzzer ON ................................................................................................... 86
4.54  edd: Device data download ........................................................................................... 87
4.55  edu: Device data upload................................................................................................ 87
4.56  ekd : Download of device parameter group.................................................................. 87
4.57  eku: Upload of device parameter group ....................................................................... 87
4.58  es : Error clearance request.......................................................................................... 88
4.59  f : Chuck temperature request ..................................................................................... 88
4.60  fp: Fail-mark inspection result request ....................................................................... 89
4.61  f1: Hot-Chuck current temperature request................................................................ 90
4.62  h : Chuck temperature setting ..................................................................................... 90
4.63  i : Parameter request .................................................................................................... 91
4.64  j2: Load the specified wafer .......................................................................................... 92
4.65  j3: Load the specified wafer .......................................................................................... 93
4.66  j4: Load the specified wafer .......................................................................................... 94
4.67  jc : Needle cleaning request.......................................................................................... 95
4.68  ji: Set up cassette for retest .......................................................................................... 95
4.69  jm: Perform Fail-mark inspection................................................................................ 96
4.70  jp: Perform probe-mark inspection .............................................................................. 97
4.71  js : Probe-mark inspection applying die....................................................................... 98
4.72  jv: End lot retesting immediately................................................................................. 99
4.73  jw : Make the cassette testing ready.......................................................................... 100
4.74  jw1 (or 2) : Cassette 1 (or 2) wafer sensing................................................................ 100

ict 发表于 2012-10-14 11:20:43


4.75  kc : Card contact count request .................................................................................. 101
4.76  ku : Up-load of a device parameter group.................................................................. 101
4.77  kd : Down-load of a device parameter group ............................................................. 104
4.78  kh : Request of site location........................................................................................ 105
4.79  l : Load device data from HD, FD, or Network Host ................................................. 106
4.80  le: Lot end request ...................................................................................................... 107
4.81  ms : Prober status request.......................................................................................... 108
4.82  mn : Down loading map data...................................................................................... 109
4.83  mp : Up loading map data .......................................................................................... 109
4.84 n6: Probing area setting ............................................................................................. 110
4.85  nc : Preset the contact counter ................................................................................... 111
4.86  nd: Request of probe tip data for a pad...................................................................... 112
4.87  ni: Request of probe-pad alignment results............................................................... 113
4.88  np: Probe-mark inspection data request.................................................................... 114
4.89  o: On-wafer information request ................................................................................ 115
4.90  p : Printout request ..................................................................................................... 116
4.91  q  : Request of start die coordinates........................................................................... 116
4.92  r : Request of Hot-chuck status .................................................................................. 117
4.93  s : Save current device data........................................................................................ 118
4.94  so: Save Device Data / Basic Operational Data......................................................... 119
4.95  st : Request of prober start ......................................................................................... 119
4.96  ur : Reading Data ID................................................................................................... 120
4.97  uw : Writing Data ID .................................................................................................. 120
4.98  vZ: Contact resistance measurement......................................................................... 121
4.99  vE: End of vZ ............................................................................................................... 121
4.100 w : Request of wafer status......................................................................................... 122
4.101  x : Request of cassette status ..................................................................................... 122
4.102  y : Yield data request .................................................................................................. 123
4.103  z : Set the current Z as contact height ....................................................................... 123
5 ERROR MESSAGES ...................................................................................................... 124
6 REMARKS ...................................................................................................................... 125
7 SUPPLEMENTARY EXPLANATION........................................................................... 126
8   APPENDIX: CHARACTER CODE CHART FOR GP-IB............................................. 129
  
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